·
|
Net revenues $2,657 million, up 16.8% year-over-year and 5.0% sequentially
|
·
|
Gross margin of 39.2%, up 90 basis points sequentially
|
·
|
Return on Net Assets (RONA) attributable to ST 19.0%*
|
Net Revenues By Market Segment / Channel (a)
(In %)
|
Q3 2010
|
Q2 2010
|
Q3 2009
|
Market Segment / Channel:
|
|||
Automotive
|
14%
|
14%
|
12%
|
Computer
|
13%
|
12%
|
13%
|
Consumer
|
13%
|
13%
|
11%
|
Industrial & Other
|
7%
|
8%
|
7%
|
Telecom
|
31%
|
32%
|
41%
|
Total OEM
|
78%
|
79%
|
84%
|
Distribution
|
22%
|
21%
|
16%
|
Operating Segment
(In Million US$)
|
Q3 2010
Net
Revenues
|
Q3 2010
Operating
Income
(Loss)
|
Q2 2010
Net
Revenues
|
Q2 2010
Operating
Income
(Loss)
|
Q3 2009
Net
Revenues
|
Q3 2009
Operating
Income
(Loss)
|
ACCI (a)
|
1,086
|
128
|
1,045
|
99
|
839
|
(33)
|
IMS (a)
|
1,012
|
199
|
945
|
137
|
706
|
23
|
Wireless (b)
|
546
|
(94)
|
525
|
(137)
|
705
|
(75)
|
Others (c)(d)
|
13
|
(40)
|
16
|
(8)
|
25
|
(111)
|
TOTAL
|
2,657
|
193
|
2,531
|
91
|
2,275
|
(196)
|
In Million US$
|
Nine Months 2010
|
Nine Months 2009
|
||
Product Segment
|
Net
Revenues
|
Operating
Income
(Loss)
|
Net
Revenues
|
Operating
Income
(Loss)
|
ACCI
|
3,041
|
275
|
2,171
|
(131)
|
IMS
|
2,767
|
427
|
1,816
|
6
|
Wireless
|
1,658
|
(347)
|
1,873
|
(308)
|
Others
|
47
|
(92)
|
67
|
(583)
|
TOTAL
|
7,513
|
263
|
5,927
|
(1,016)
|
|
·
|
In a major step of the joint-venture agreement signed early this year, Enel Green Power, Sharp and STMicroelectronics on August 2, 2010, signed a binding letter of commitment for a 150 million euro project financing agreement for the development of what will be Italy’s biggest photovoltaic panel factory. More recently, the 3Sun partners announced the appointment by its Board of Directors of both the Chairman and Chief Executive Officer. Andrea Cuomo will serve as 3Sun Chairman, while retaining his position at ST as Executive Vice President for the Europe, Middle East and Africa Region, and Mauro Curiale, currently CEO of Enel SOLE, has been named Chief Executive Officer.
|
|
·
|
ST was recognized for its achievements in ‘Sustainability’ by Nokia, the world leader in mobile communications. In presenting its award for ‘Outstanding Achievement in the Category of Sustainability’ to ST at Nokia World 2010 in London, Nokia applauded “STMicroelectronics’ outstanding commitment and efforts in sustainable business practices.”
|
|
·
|
Microcontrollers (MCUs)
|
|
o
|
Key design win for ST’s 32-bit Power Architecture® MCU family for a steering application for a major European maker’s complete car platform.
|
|
o
|
Achieved ‘first silicon’ of ST’s proprietary 55nm embedded-Flash process at its 300mm wafer fab in Crolles, for implementation in ST’s family of automotive MCUs.
|
|
·
|
Body Electronics
|
|
o
|
Strengthened leadership in ‘door zone’ applications with a design win from a leading European car maker for a new device that embeds ‘Partial Networking’ IP. ‘Partial Networking’ can make a significant contribution to reductions in cost and CO2 emissions and is expected to become standard in car networking.
|
|
o
|
Important design win for a smart gate-driver IC in a world-leading power-steering platform. The chip will be supplied to all three OEM suppliers to the platform, breaking 15 years of dominance by ST’s major competitor in this field.
|
|
·
|
Safety applications
|
|
o
|
First major award for ST’s third-generation vision processor, EyeQ3, from a major European car maker as a standard fit worldwide from 2014. The device includes a full package of Advanced Driver-Assistance System (ADAS) functionality, including pedestrian and animal detection, vehicle detection, traffic-sign recognition, intelligent high-beam control and collision avoidance.
|
|
o
|
Began supplying a complete smart-power airbag chipset for two vehicle platforms to a major car maker in Japan, leading to the beginning of new business with the OEM’s selected supplier.
|
|
·
|
Infotainment
|
|
o
|
Shipment of the Cartesio+ navigation processor in high volumes to Garmin for its next-generation Personal Navigation Devices (PNDs).
|
|
o
|
First to production for a start/stop-compliant car radio amplifier.
|
|
o
|
Strengthened leadership in car radio applications with a major design win from a leading maker of tuners and power amplifiers in Japan.
|
|
o
|
Introduction of new ConneXt I/O Hub for next-generation in-vehicle entertainment applications.
|
|
·
|
Set-top boxes (STBs)
|
|
o
|
Major design win at Sagemcom for the STi7108, ST’s most advanced hybrid broadcast/broadband STB decoder System-on-Chip (SoC).
|
|
o
|
More than 15 high-definition decoder platforms, implemented in 55nm technology, designed and deployed at major operators worldwide, reaching cumulative shipments of 20 million units by the end of the quarter.
|
|
o
|
Major hybrid broadcast/broadband platform awarded to ST for deployment in the UK.
|
|
o
|
Design win for ‘analog switch-off’ migration to HDTV and a major satellite broadcaster in the Middle East with deployment starting in 2011.
|
|
o
|
Massive deployment of highly integrated and high-performance MPEG-2 cable (STi5197) and satellite (STi5189) platforms in China, India and Latin America.
|
|
·
|
Integrated Digital TV (iDTV)
|
|
o
|
Launched three new highly integrated digital TV SoCs, enabling enhanced user experience and new Internet TV services. The FLI7525 ‘Freeman Premier’ delivers the highest level of integration for 120Hz 3D TV solutions; the FLI7540 ‘Freeman Ultra’ and the FLI2520 ‘Diamond’, a companion chip, deliver uncompromised system performance for 240Hz and 3D TV solutions embedding the industry’s first integration of the VESA-standard iDP (Internal DisplayPort) panel interface.
|
|
o
|
Key design-ins for the FLI7540 ‘Freeman Ultra’ include a European TV maker acclaimed for its performance and trend-setting designs, and for the FLI7525 ‘Freeman Premier’ include a recognized Japanese TV ODM supplier to the European market.
|
|
·
|
Monitors
|
|
o
|
Major design win for DisplayPort and TV scaler technology from a key tier-one OEM.
|
|
o
|
Several new design wins for the STD80xx Faroudja® -based LCD-controller SoC family, which offers advanced image processing and DisplayPort and HDMI receivers for monitor and multi-function-monitor (MFM) applications.
|
|
·
|
Audio
|
|
o
|
Key design win for SoundTerminal ICs from a top-tier TV maker in Japan for its 2011 model. The win strengthens the SoundTerminal family’s capability to deliver ‘filterless operation,’ which can lead to significant cost reductions for customers.
|
|
o
|
Design win for a new ASIC implemented in 32nm low-power high-performance CMOS technology, featuring embedded DRAM, from a world leader in high-speed and high-precision instrumentation applications.
|
|
o
|
Introduction of the SPEAr1310 – the industry’s first embedded microprocessor to combine two ARM Cortex-A9 cores with DDR3-1066 (third-generation double-data rate at 1066-Gbit/s) memory interface. Manufactured in low-power 55nm CMOS technology, the processor delivers high-performance computing and customizability
|
|
·
|
MEMS
|
|
o
|
High-volume sales of three-axis gyroscopes are spreading into mobile phone and gaming platforms; ST earned numerous design wins at mobile phone makers in US, Korea and Japan.
|
|
o
|
Ramping up volume production of 3-axis accelerometer for new MP3 player from a leading consumer manufacturer.
|
|
o
|
Introduction of high-performance, low-power, stereo MEMS microphone, targeting existing and emerging audio applications across a range of market segments. The digital microphone IC is now under qualification for notebook PCs.
|
|
o
|
e-Compass IC now in production at major mobile phone maker in China.
|
|
·
|
Sensors
|
|
o
|
Strong interest emerging from next-generation Smartphone makers for new pressure sensor.
|
|
o
|
Starting production of bio-sensors for major medical company in the US.
|
|
·
|
Analog
|
|
o
|
Design win for ‘Rad-Hard’ (radiation-hardened) op-amps for the Galileo European navigation satellite system.
|
|
o
|
New op amp now in full production at major mobile maker in Korea.
|
|
o
|
Innovative smart pushbutton on/off controller IC in production at a major eBook manufacturer in Asia.
|
|
o
|
Design win for high-efficiency buck regulator for notebook PCs from a major US computer maker.
|
|
o
|
Controller IC gained the major share in a switched-mode power-supply design for a new LED-backlit TV in Korea.
|
|
o
|
Design win for the ‘e-Fuse’ family for hard-disk arrays from a US computer maker.
|
|
o
|
Design win for new power IC in new utility metering systems in the US.
|
|
o
|
STarGRID™ power-line communication SoC being used in advanced Automatic Meter Management equipment in ‘STAR Project’ in Spain.
|
|
o
|
MDmesh V power transistors continue their success with design wins for solar panel applications and high-end switched-mode power-supply adapters.
|
|
o
|
Two design wins for IGBTs and intelligent power modules, respectively, for leading industrial and appliance customers.
|
|
o
|
Design win for a high-voltage power MOSFET in a battery charger for an important mobile consumer product.
|
|
o
|
Design wins for a low-voltage PowerFLAT™ power MOSFET with two leading PC makers.
|
|
o
|
Production ramp-up of a specially customized RF power transistor for a major medical MRI equipment manufacturer in Europe.
|
|
o
|
Introduction of the world’s smallest flow-through dual-line protection devices, designed to protect USB2.0 ports and micro-ports in portable applications.
|
|
o
|
Introduction of a new generation of common-mode filter ICs, integrating ESD protection, for high-speed data communications, such as IEEE1394, USB 3.0, Serial ATA and PCI-Express based applications.
|
|
o
|
Extension of the STM8L EnergyLite™ ultra-low-power MCU family with new devices offering features, such as larger program/data memory, high-accuracy time-keeping, a controller for up to 16 touch-sensitive keys, and support for 128-bit AES encryption.
|
|
o
|
Launch of the high-performance STM32 Audio Engine, delivering access to a professionally developed high-quality codec, together with rich audio-system features, low memory usage and long battery life.
|
|
o
|
Design-ins for the 32-bit STM32 microcontroller at world leading OEMs in healthcare applications, such as glucose meters and respiratory systems, and in smart metering.
|
|
o
|
Shipment of several million units of the STM32 Performance Line MCUs to a major OEM for gaming accessories.
|
|
o
|
Design-ins at major handset and smartcard manufacturers for the ST21NFCA, ST’s single-chip solutions for NFC (Near Field Communication) applications.
|
|
o
|
Design-ins at major smartcard manufacturers for the 32-bit ST33F1M Secure MCU for high-end SIM card applications.
|
|
o
|
Several design-ins for ST’s new and innnovative dual-interface EEPROM at key metering and medical OEMs.
|
|
o
|
Two leading handset manufacturers chose solutions from ST-Ericsson’s high-value entry portfolio for new multimedia phones.
|
|
o
|
Samsung selected the cost effective and highly integrated single-chip multimedia G4852 platform to underpin its new E2152 phone.
|
|
o
|
Sony Ericsson selected the very power-efficient, compact and cost-effective EDGE platform for the Sony Ericsson Spiro with Walkman™ music phone.
|
|
o
|
M7211 TD-HSDPA modem platform selected by Sony Ericsson to empower its first TD smartphone, the A8i, which was unveiled in August in China.
|
|
o
|
Launched the M5730, an extremely power-efficient and compact HSPA+ modem capable of transmitting data at speeds of up to 21Mbps. Already being sampled by customers, mobile devices including the HSPA+ modem, such as smartphones and other connected devices, are expected to be shipping in early 2011.
|
|
o
|
ST-Ericsson underlined its commitment to be a leader in mobile computing, and to continue to introduce new technologies and architectures to the market early, by cooperating with ARM as a lead partner for the new Cortex-A15 MPCore processor.
|
|
·
|
Changes in demand in the key application markets and from key customers served by our products, which make it extremely difficult to accurately forecast and plan our future business activities. In particular, following a period of significant order cancellations in 2009, we have in 2010 experienced a strong surge in customer demand, which has led to capacity constraints in certain applications, and we may in the future, in case of excessive inventory at customers or distribution channels, experience order cancellations;
|
|
·
|
our ability to utilize and operate our manufacturing facilities at sufficient levels to cover fixed operating costs during periods of reduced customer demand, as well as our ability to ramp up production efficiently and rapidly to respond to increased customer demand, in an intensely cyclical and competitive industry, and the financial impact of obsolete or excess inventories if actual demand differs from our expectations;
|
|
·
|
the operations of the ST-Ericsson Wireless joint venture, which represents a significant investment and risk for our business and which may lead to significant additional impairment and restructuring charges, in the event ST-Ericsson is unable to successfully compete in a rapidly changing and increasingly competitive market;
|
|
·
|
our ability to compete in the semiconductor industry since a high percentage of our costs are fixed and are incurred in Euros and currencies other than U.S. dollars, especially in light of the increasing volatility in the foreign exchange markets and, more particularly, in the U.S. dollar exchange rate as compared to the Euro and the other major currencies we use for our operations;
|
|
·
|
the outcome of ongoing litigation as well as any new litigation to which we may become a defendant;
|
|
·
|
changes in our overall tax position as a result of changes in tax laws or the outcome of tax audits, and our ability to accurately estimate tax credits, benefits, deductions and provisions and to realize deferred tax assets;
|
|
·
|
the impact of intellectual property (“IP”) claims by our competitors or other third parties, and our ability to obtain required licenses on reasonable terms and conditions;
|
|
·
|
product warranty or liability claims based on epidemic failures or recalls by our customers for a product containing one of our parts;
|
|
·
|
our ability in an intensively competitive environment to secure customer acceptance and to achieve our pricing expectations for high-volume supplies of new products in whose development we have been, or are currently, investing;
|
|
·
|
availability and costs of raw materials, utilities, third-party manufacturing services, or other supplies required by our operations; and
|
|
·
|
changes in the political, social or economic environment, including as a result of military conflict, social unrest and/or terrorist activities, economic turmoil, as well as natural events such as severe weather, health risks, epidemics, earthquakes, volcano eruptions or
|
|
|
other acts of nature in, or affecting, the countries in which we, our key customers or our suppliers, operate.
|
(Attachment A)
|
Q3 2010
(US$ millions and cents per share)
|
Gross Profit
|
Operating Income
|
Net Earnings
|
Corresponding EPS (diluted)
|
U.S. GAAP
|
1,041
|
193
|
198
|
0.22
|
Impairment & Restructuring
|
27
|
18
|
||
Estimated Income Tax Effect
|
(5)
|
|||
Non-U.S GAAP
|
1,041
|
220
|
211
|
0.23
|
Q2 2010
(US$ millions and cents per share)
|
Gross Profit
|
Operating Income
|
Net Earnings
|
Corresponding EPS (diluted)
|
U.S. GAAP
|
968
|
91
|
356
|
0.39
|
Impairment & Restructuring
|
12
|
8
|
||
Equity Investment Divestiture
|
(265)
|
|||
Estimated Income Tax Effect
|
60
|
|||
Non-U.S GAAP
|
968
|
103
|
159
|
0.18
|
Q3 2009
(US$ millions and cents per share)
|
Gross Profit
|
Operating Income (Loss)
|
Net Earnings
(Loss)
|
Corresponding EPS
|
U.S. GAAP
|
713
|
(196)
|
(201)
|
(0.23)
|
Impairment & Restructuring
|
53
|
45
|
||
Estimated Income Tax Effect
|
3
|
|||
Non-U.S GAAP
|
713
|
(143)
|
(153)
|
(0.17)
|
Net Financial Position (in US$ millions)
|
September 25,
2010
|
June 26,
2010
|
September 26, 2009
|
Cash and cash equivalents, net of bank overdrafts
|
1,473
|
1,268
|
1,576
|
Marketable securities, current (a)
|
1,176
|
1,094
|
955
|
Short-term deposits
|
67
|
62
|
-
|
Non-current restricted cash
|
-
|
250
|
250
|
Marketable securities, non-current (a)
|
64
|
57
|
170
|
Total financial resources
|
2,780
|
2,731
|
2,951
|
Current portion of long-term debt and short-term debt
|
(717)
|
(802)
|
(230)
|
Long-term debt
|
(1,185)
|
(1,227)
|
(2,455)
|
Total financial debt
|
(1,902)
|
(2,029)
|
(2,685)
|
Net financial position
|
878
|
702
|
266
|
Net Operating Cash Flow (in US$ millions)
|
Q3 2010
|
Q2 2010
|
Q3 2009
|
Net cash from (used in) operating activities
|
548
|
361
|
225
|
Net cash from (used in) investing activities
|
(120)
|
(300)
|
(311)
|
Payment for purchases of (proceeds from sale of) current and non-current marketable securities and short-term deposits and restricted cash, net
|
(204)
|
151
|
181
|
Net operating cash flow
|
224
|
212
|
95
|
Net operating cash flow (ex M&A)
|
228
|
212
|
100
|
STMicroelectronics N.V.
|
||||||||
Consolidated Statements of Income
|
||||||||
(in million of U.S. dollars, except per share data ($))
|
||||||||
Three Months Ended
|
||||||||
(Unaudited)
|
(Unaudited)
|
|||||||
September 25,
|
September 26,
|
|||||||
2010
|
2009
|
|||||||
Net sales
|
2,634 | 2,269 | ||||||
Other revenues
|
23 | 6 | ||||||
NET REVENUES
|
2,657 | 2,275 | ||||||
Cost of sales
|
(1,616 | ) | (1,562 | ) | ||||
GROSS PROFIT
|
1,041 | 713 | ||||||
Selling, general and administrative
|
(281 | ) | (290 | ) | ||||
Research and development
|
(558 | ) | (595 | ) | ||||
Other income and expenses, net
|
18 | 29 | ||||||
Impairment, restructuring charges and other related closure costs
|
(27 | ) | (53 | ) | ||||
Total Operating Expenses
|
(848 | ) | (909 | ) | ||||
OPERATING INCOME (LOSS)
|
193 | (196 | ) | |||||
Interest income (expense), net
|
(2 | ) | 4 | |||||
Loss on equity investments
|
(8 | ) | (42 | ) | ||||
Loss on financial instruments, net
|
(1 | ) | - | |||||
INCOME (LOSS) BEFORE INCOME TAXES
|
182 | (234 | ) | |||||
AND NONCONTROLLING INTEREST
|
||||||||
Income tax expense
|
(44 | ) | (15 | ) | ||||
INCOME (LOSS) BEFORE NONCONTROLLING INTEREST
|
138 | (249 | ) | |||||
Net loss attributable to noncontrolling interest
|
60 | 48 | ||||||
NET INCOME (LOSS) ATTRIBUTABLE TO PARENT COMPANY
|
198 | (201 | ) | |||||
EARNINGS (LOSS) PER SHARE (BASIC) ATTRIBUTABLE TO PARENT COMPANY SHAREHOLDERS
|
0.22 | (0.23 | ) | |||||
EARNINGS (LOSS) PER SHARE (DILUTED) ATTRIBUTABLE TO PARENT COMPANY SHAREHOLDERS
|
0.22 | (0.23 | ) | |||||
NUMBER OF WEIGHTED AVERAGE
|
||||||||
SHARES USED IN CALCULATING
|
||||||||
DILUTED EARNINGS (LOSS) PER SHARE
|
910.1 | 878.3 |
STMicroelectronics N.V.
|
||||||||
Consolidated Statements of Income
|
||||||||
(in million of U.S. dollars, except per share data ($))
|
||||||||
Nine months ended
|
||||||||
(Unaudited)
|
(Unaudited)
|
|||||||
September 25,
|
September 26,
|
|||||||
2010
|
2009
|
|||||||
Net sales
|
7,452 | 5,895 | ||||||
Other revenues
|
61 | 32 | ||||||
NET REVENUES
|
7,513 | 5,927 | ||||||
Cost of sales
|
(4,627 | ) | (4,257 | ) | ||||
GROSS PROFIT
|
2,886 | 1,670 | ||||||
Selling, general and administrative
|
(864 | ) | (856 | ) | ||||
Research and development
|
(1,747 | ) | (1,763 | ) | ||||
Other income and expenses, net
|
60 | 127 | ||||||
Impairment, restructuring charges and other related closure costs
|
(72 | ) | (194 | ) | ||||
Total Operating Expenses
|
(2,623 | ) | (2,686 | ) | ||||
OPERATING INCOME (LOSS)
|
263 | (1,016 | ) | |||||
Other-than-temporary impairment charge on financial assets
|
- | (72 | ) | |||||
Interest income, net
|
2 | 6 | ||||||
Loss on equity investments and gain on investment divestiture
|
251 | (324 | ) | |||||
Loss on financial instruments, net
|
(12 | ) | (8 | ) | ||||
INCOME (LOSS) BEFORE INCOME TAXES
|
504 | (1,414 | ) | |||||
AND NONCONTROLLING INTEREST
|
||||||||
Income tax benefit (expense)
|
(99 | ) | 142 | |||||
INCOME (LOSS) BEFORE NONCONTROLLING INTEREST
|
405 | (1,272 | ) | |||||
Net loss attributable to noncontrolling interest
|
206 | 211 | ||||||
NET INCOME (LOSS) ATTRIBUTABLE TO PARENT COMPANY
|
611 | (1,061 | ) | |||||
EARNINGS (LOSS) PER SHARE (BASIC) ATTRIBUTABLE TO PARENT COMPANY SHAREHOLDERS
|
0.69 | (1.21 | ) | |||||
EARNINGS (LOSS) PER SHARE (DILUTED) ATTRIBUTABLE TO PARENT COMPANY SHAREHOLDERS
|
0.68 | (1.21 | ) | |||||
NUMBER OF WEIGHTED AVERAGE
|
||||||||
SHARES USED IN CALCULATING
|
||||||||
DILUTED EARNINGS (LOSS) PER SHARE
|
912.2 | 876.4 |
STMicroelectronics N.V.
|
||||||||||||
CONSOLIDATED BALANCE SHEETS
|
||||||||||||
As at
|
September 25,
|
June 26,
|
December 31,
|
|||||||||
In million of U.S. dollars
|
2010
|
2010
|
2009
|
|||||||||
(Unaudited)
|
(Unaudited)
|
(Audited)
|
||||||||||
ASSETS
|
||||||||||||
Current assets:
|
||||||||||||
Cash and cash equivalents
|
1,473 | 1,268 | 1,588 | |||||||||
Restricted cash
|
43 | 250 | - | |||||||||
Short-term deposits
|
67 | 62 | - | |||||||||
Marketable securities
|
1,556 | 1,557 | 1,032 | |||||||||
Subordinated notes
|
- | 78 | - | |||||||||
Trade accounts receivable, net
|
1,424 | 1,442 | 1,367 | |||||||||
Inventories, net
|
1,432 | 1,302 | 1,275 | |||||||||
Deferred tax assets
|
219 | 177 | 298 | |||||||||
Assets held for sale
|
29 | 29 | 31 | |||||||||
Other receivables and assets
|
727 | 651 | 753 | |||||||||
Total current assets
|
6,970 | 6,816 | 6,344 | |||||||||
Goodwill
|
1,060 | 1,041 | 1,071 | |||||||||
Other intangible assets, net
|
747 | 771 | 819 | |||||||||
Property, plant and equipment, net
|
3,868 | 3,618 | 4,081 | |||||||||
Long-term deferred tax assets
|
375 | 414 | 333 | |||||||||
Equity investments
|
143 | 66 | 273 | |||||||||
Restricted cash
|
- | - | 250 | |||||||||
Non-current marketable securities
|
165 | 246 | 42 | |||||||||
Other investments and other non-current assets
|
378 | 300 | 442 | |||||||||
6,736 | 6,456 | 7,311 | ||||||||||
Total assets
|
13,706 | 13,272 | 13,655 | |||||||||
LIABILITIES AND SHAREHOLDERS' EQUITY
|
||||||||||||
Current liabilities:
|
||||||||||||
Short-term borrowings and current portion of long-term debt
|
717 | 802 | 176 | |||||||||
Trade accounts payable
|
1,411 | 1,346 | 883 | |||||||||
Other payables and accrued liabilities
|
1,140 | 1,197 | 1,049 | |||||||||
Dividends payable to shareholders
|
123 | 185 | 26 | |||||||||
Deferred tax liabilities
|
3 | 10 | 20 | |||||||||
Accrued income tax
|
203 | 124 | 126 | |||||||||
Total current liabilities
|
3,597 | 3,664 | 2,280 | |||||||||
Long-term debt
|
1,185 | 1,227 | 2,316 | |||||||||
Reserve for pension and termination indemnities
|
299 | 280 | 317 | |||||||||
Long-term deferred tax liabilities
|
30 | 21 | 37 | |||||||||
Other non-current liabilities
|
242 | 239 | 342 | |||||||||
1,756 | 1,767 | 3,012 | ||||||||||
Total liabilities
|
5,353 | 5,431 | 5,292 | |||||||||
Commitment and contingencies
|
||||||||||||
Equity
|
||||||||||||
Parent company shareholders' equity
|
||||||||||||
Common stock (preferred stock: 540,000,000 shares authorized, not issued;
|
1,156 | 1,156 | 1,156 | |||||||||
common stock: Euro 1.04 nominal value, 1,200,000,000 shares authorized, 910,354,305 shares
|
||||||||||||
issued, 881,602,137 shares outstanding)
|
||||||||||||
Capital surplus
|
2,506 | 2,497 | 2,481 | |||||||||
Accumulated result
|
3,022 | 2,828 | 2,723 | |||||||||
Accumulated other comprehensive income
|
969 | 627 | 1,164 | |||||||||
Treasury stock
|
(304 | ) | (308 | ) | (377 | ) | ||||||
Total parent company shareholders' equity
|
7,349 | 6,800 | 7,147 | |||||||||
Noncontrolling interest
|
1,004 | 1,041 | 1,216 | |||||||||
Total equity
|
8,353 | 7,841 | 8,363 | |||||||||
Total liabilities and equity
|
13,706 | 13,272 | 13,655 |
STMicroelectronics N.V.
|
SELECTED CASH FLOW DATA
|
Cash Flow Data (in US$ millions)
|
Q3 2010
|
Q2 2010
|
Q3 2009
|
Net Cash from operating activities
|
548
|
361
|
225
|
Net Cash used in investing activities
|
(120)
|
(300)
|
(311)
|
Net Cash used in financing activities
|
(246)
|
(167)
|
(36)
|
Net Cash increase (decrease)
|
205
|
(155)
|
(109)
|
Selected Cash Flow Data (in US$ millions)
|
Q3 2010
|
Q2 2010
|
Q3 2009
|
Depreciation & amortization
|
294
|
309
|
342
|
Payment for Capital expenditures
|
(298)
|
(134)
|
(98)
|
Dividends paid to shareholders
|
(62)
|
(62)
|
(26)
|
Change in inventories, net
|
(84)
|
(75)
|
174
|
STMicroelectronics N.V.
|
||||
Date:
|
October 27, 2010
|
By:
|
/s/ Carlo Ferro
|
|
Name:
|
Carlo Ferro
|
|||
Title:
|
Executive Vice President and
Chief Financial Officer |