CAMTEK LTD.
(Translation of
Registrant’s Name into English)
Ramat Gavriel
Industrial Zone
P.O. Box 544
Migdal Haemek 23150
ISRAEL
(Address of Principal Corporate
Offices)
Indicate by check mark whether the registrant files or will file annual reports under cover of Form 20-F or Form 40-F.
Form 20-F x Form 40-F o
Indicate by check mark whether the registrant by furnishing the information contained in this Form is also thereby furnishing the information to the Commission pursuant to Rule 12g3-2(b) under the Securities and Exchange Act of 1934.
Yes o No x
Attached
hereto as Exhibit 99.1 and incorporated by reference herein is a press release of the
registrant, dated April 20, 2004, ANNOUNCES RELISTING ON THE NASDAQ NATIONAL MARKET.
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Pursuant to the requirements of the Securities Exchange Act of 1934, the Registrant has duly caused this report to be signed on its behalf by the undersigned, thereunto duly authorized.
| CAMTEK LTD. (Registrant) BY: /S/ MOSHE AMIT —————————————— Moshe Amit, Executive Vice President and Chief Financial Officer |
Dated: April 20, 2004
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| Exhibit 99.1 |
| FOR IMMEDIATE RELEASE APRIL 20, 2004 |
| CAMTEK CONTACT: Moshe Amit +972-4-604-8308 +972-4-604 8300 (fax) mosheamit@camtek.co.il |
MIGDAL HA’EMEK, Israel – April 20, 2004 – Camtek Ltd. (NASDAQ:CAMT) today announced that the Nasdaq Stock Market has approved its application for the relisting of its ordinary shares on the Nasdaq National Market, subject to the company maintaining a $5 minimum bid price upon its admission for trading on the Nasdaq National Market. Camtek expects its ordinary shares to begin trading on the Nasdaq National Market on April 22, 2004 under the ticker symbol “CAMT,” which is the same symbol under which Camtek’s ordinary shares are currently traded on the Nasdaq SmallCap Market.
With headquarters in Migdal Ha’Emek Israel, Camtek Ltd., designs, develops, manufactures, and markets automatic optical inspection systems and related products. Camtek’s automatic inspection systems are used to enhance both production processes and yield for manufacturers in the printed circuit board industry, the high density interconnect substrate industry and the semiconductor manufacturing and packaging industry.
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