·
|
First quarter financial results in line with expectations; year-over-year operating income improvement of $188 million before impairment and restructuring charges
|
·
|
Strategic agreement for 28nm FD-SOI technology signed with a top-tier foundry
|
·
|
Stable cash dividend of US$0.10 per share for both the second and third quarters of 2014 to be proposed to the 2014 Annual General Meeting of Shareholders
|
U.S. GAAP
(Million US$)
|
Q1 2014
|
Q4 2013
|
Q1 2013(a)
|
Net Revenues
|
1,825
|
2,015
|
2,009
|
Gross Margin
|
32.8%
|
32.9%
|
31.3%
|
Operating Income (Loss), as reported
|
(4)
|
(11)
|
(281)
|
Net Income (Loss) attributable to parent company
|
(24)
|
(36)
|
(171)
|
Non-U.S. GAAP*
(Million US$)
|
Q1 2014
|
Q4 2013
|
Q1 2013
|
Operating Income (Loss) before impairment and restructuring charges
|
8
|
18
|
(180)
|
Operating Margin before impairment and restructuring charges
|
0.4%
|
0.9%
|
(8.9%)
|
Net Revenues By Product Line and Segment
(Million US$)
|
Q1 2014
|
Q4 2013
|
Q1 2013
|
Analog & MEMS (AMS)
|
304
|
337
|
313
|
Automotive (APG)
|
445
|
449
|
385
|
Industrial & Power Discrete (IPD)
|
442
|
447
|
429
|
Sense & Power and Automotive Products (SP&A)
|
1,191
|
1,233
|
1,127
|
Digital Convergence Group (DCG) (a)
|
205
|
307
|
496
|
Imaging, Bi-CMOS ASIC and Silicon Photonics (IBP) (a)
|
77
|
112
|
72
|
Microcontroller, Memory & Secure MCU (MMS)
|
346
|
357
|
299
|
Embedded Processing Solutions (EPS)
|
628
|
776
|
867
|
Others
|
6
|
6
|
15
|
Total
|
1,825
|
2,015
|
2,009
|
(a)
|
Reflecting the transfer of Wireless (legacy ST-Ericsson products) and the Image Signal Processor business unit from IBP to DCG as of January 1, 2014, the Company has reclassified prior- period revenues.
|
Net Revenues By Market Channel (%)
|
Q1 2014
|
Q4 2013
|
Q1 2013
|
Total OEM
|
70%
|
73%
|
75%
|
Distribution
|
30%
|
27%
|
25%
|
Operating Segment
(Million US$)
|
Q1 2014
Net
Revenues
|
Q1 2014
Operating
Income
(Loss)
|
Q4 2013
Net
Revenues
|
Q4 2013
Operating
Income
(Loss)
|
Q1 2013
Net
Revenues
|
Q1 2013
Operating
Income
(Loss)
|
Sense & Power and
Automotive Products
(SP&A)
|
1,191
|
104
|
1,233
|
96
|
1,127
|
58
|
Embedded Processing
Solutions (EPS) (a)
|
628
|
(80)
|
776
|
(66)
|
867
|
(210)
|
Others (b)(c)
|
6
|
(28)
|
6
|
(41)
|
15
|
(129)
|
TOTAL
|
1,825
|
(4)
|
2,015
|
(11)
|
2,009
|
(281)
|
Revenues
(Million US$)
|
Q1 2013
|
Q2 2013
|
Q3 2013
|
Q4 2013
|
FY 2013
|
Q1 2014
|
DCG
|
496
|
375
|
314
|
307
|
1,491
|
205
|
IBP
|
72
|
98
|
128
|
112
|
410
|
77
|
|
·
|
On February 10, ST and InvenSense announced that they had settled all pending proceedings between them and have entered into a patent cross-license agreement. Under the terms of the settlement, InvenSense made a one-time $15 million payment in the first quarter of 2014 but neither ST nor InvenSense has made any admission of liability. ST will collect royalties under the terms of the patent cross license in the future. The expected royalties will not be material to ST’s financial results. Other terms between the parties are confidential.
|
|
·
|
On April 9, the European Commission approved €34 million in aid for the TOURS 2015 research program led by ST; the aid, granted by France to ST for the development of new technologies in the Nanoelectronics sector, was in line with EU state-aid rules. In particular, the Commission considers that the project will help achieve EU scientific and environmental targets without unduly distorting competition.
|
|
·
|
Continued building global momentum in set-top boxes, collecting several design wins including HEVC HD, HEVC UHD, and DOCSIS 3.0 sockets across Cannes, Alicante, Liege, and all product families.
|
|
·
|
Announced expansion of offering in set-top box, including new devices in the Liege family and cooperation with third-party partners to provide complete and seamless solutions for the worldwide broadcast markets.
|
|
·
|
Continued to see strong momentum for 28nm FD-SOI, collecting two additional design wins.
|
|
·
|
Previewed groundbreaking next-generation computing architecture for the Digital Home that builds on current ARM-based SoCs while leveraging 64-bit ARM cores to support the increasing performance and memory requirements of future SoCs.
|
|
·
|
Won new silicon-photonics project and transceiver chipset for FibreChannel high-speed data-storage applications with a key customer.
|
|
·
|
Captured design win for analog switch for cell-phone-antenna chipset.
|
|
·
|
Awarded a major socket for time-of-flight photonic sensor for an innovative camera system by a leading smart-phone manufacturer.
|
|
·
|
Began shipping dedicated imaging-processing chip to a leading Asian smart-phone manufacturer for their flagship phone.
|
|
·
|
Ramped production of STM32 microcontrollers for three new Samsung smartwatches that were unveiled at MWC2014.
|
|
·
|
Earned wins for lower-end ARM® Cortex®-M STM32F0 in several sensors, lighting applications, and gaming accessories.
|
|
·
|
Captured Flash-based Secure MCU win for a major smartcard health program in Europe.
|
|
·
|
Announced new platforms (STM32 Nucleo) and software (STM32Cube) to enhance the development ecosystem and make STM32s even easier to design with.
|
|
·
|
Extended the industry’s broadest portfolio of ARM Cortex-M microcontrollers with the introduction of STM32L0 ultra-low power series featuring ARM Cortex M0+ core.
|
|
·
|
Awarded high-density standard-EEPROM socket for parameter storage in an NFC module from a worldwide key player.
|
|
·
|
Ramped production of touch-screen controllers for new Samsung smartphone that was launched in the first quarter of 2014. Touch-screen controller also gained momentum with additional big wins in tablets in Asia.
|
|
·
|
Captured 100% share in all pressure sensors with a leading consumer brand in Asia.
|
|
·
|
Introduced 2x2mm pressure-sensor in unique package technology that protects the sensing element, making it ideal for wearable applications.
|
|
·
|
Increased penetration with multiple 6-axis sensor wins across Greater China region in leading manufacturers.
|
|
·
|
Expanded presence of accelerometers in automotive-infotainment market with design awards from top players across the globe.
|
|
·
|
Revealed 9-axis movement and position sensor that delivers enhanced performance with reduced power demand in a package almost 35% smaller than previous generations.
|
|
·
|
Leveraged outstanding low-power performance of Bluetooth Low Energy and Spirit1 sub-gigahertz radios with multiple design wins and orders.
|
|
·
|
Reconfirmed leadership in automotive-grade high-precision op amp with design-win at a leading Americas manufacturer.
|
|
·
|
Announced broad portfolio of analog devices that comprise the industry’s most complete set of building blocks for creating innovative wearable applications.
|
|
·
|
Signed an exclusive agreement to supply audio amplifiers to a market-leading manufacturer of audio sound systems.
|
|
·
|
Captured the win for the EyeQ4 next-generation advanced driver assist system (ADAS) vision processor from Mobileye, the top supplier of such systems.
|
|
·
|
Earned breakthrough for car audio processor with a win with a major manufacturer in the Japanese market.
|
|
·
|
Launched third-generation single-chip standalone positioning family capable of receiving signals from all of the major satellite navigation systems.
|
|
·
|
Secured qualifications from several power-supply manufacturers for low-voltage MOSFETS.
|
|
·
|
Launched complete and configurable plug-and-play street-lighting solution for efficient control of dimmable, high-brightness LED strings to optimize dimming and minimize power in idle conditions.
|
|
·
|
Earned first win from a large Chinese manufacturer for high-voltage IGBT for a telecom application.
|
|
·
|
Secured wins in smartphone and GPS applications for tunable integrated RF capacitor and ultraminiature balun with leading manufacturers.
|
|
·
|
Landed a design win for a SmartGrid platform in an Eastern Europe pilot program.
|
|
·
|
Won sockets in key mobile applications from global players for ultra-miniature filtering and protection devices.
|
|
·
|
Revealed high-voltage silicon carbide power MOSFETs that help save at least 50% of previously wasted energy.
|
INVESTOR RELATIONS:
|
MEDIA RELATIONS:
|
|
Tait Sorensen
|
Nelly Dimey
|
|
Group VP, Investor Relations
|
Director, Corporate Media and Public Relations
|
|
Tel: +1 602 485 2064
|
Tel: + 33 1 58 07 77 85
|
|
tait.sorensen@st.com
|
nelly.dimey@st.com
|
STMicroelectronics N.V.
|
Consolidated Statements of Income
|
(in millions of U.S. dollars, except per share data ($))
|
Three Months Ended
|
||||||||
(Unaudited)
|
(Unaudited)
|
|||||||
March 29,
|
March 30,
|
|||||||
2014
|
2013
|
|||||||
Net sales
|
1,801 | 2,003 | ||||||
Other revenues
|
24 | 6 | ||||||
NET REVENUES
|
1,825 | 2,009 | ||||||
Cost of sales
|
(1,226 | ) | (1,381 | ) | ||||
GROSS PROFIT
|
599 | 628 | ||||||
Selling, general and administrative
|
(228 | ) | (279 | ) | ||||
Research and development
|
(378 | ) | (533 | ) | ||||
Other income and expenses, net
|
15 | 4 | ||||||
Impairment, restructuring charges and other related closure costs
|
(12 | ) | (101 | ) | ||||
Total Operating Expenses
|
(603 | ) | (909 | ) | ||||
OPERATING LOSS
|
(4 | ) | (281 | ) | ||||
Interest expense, net
|
(2 | ) | (7 | ) | ||||
Loss on equity-method investments
|
(8 | ) | (13 | ) | ||||
Gain on financial instruments, net
|
1 | - | ||||||
LOSS BEFORE INCOME TAXES
|
(13 | ) | (301 | ) | ||||
AND NONCONTROLLING INTEREST
|
||||||||
Income tax benefit (expense)
|
(9 | ) | 4 | |||||
NET LOSS
|
(22 | ) | (297 | ) | ||||
Net loss (income) attributable to noncontrolling interest
|
(2 | ) | 126 | |||||
NET LOSS ATTRIBUTABLE TO PARENT COMPANY
|
(24 | ) | (171 | ) | ||||
EARNINGS PER SHARE (BASIC) ATTRIBUTABLE TO PARENT COMPANY STOCKHOLDERS
|
(0.03 | ) | (0.19 | ) | ||||
EARNINGS PER SHARE (DILUTED) ATTRIBUTABLE TO PARENT COMPANY STOCKHOLDERS
|
(0.03 | ) | (0.19 | ) | ||||
NUMBER OF WEIGHTED AVERAGE
|
||||||||
SHARES USED IN CALCULATING
|
||||||||
DILUTED EARNINGS PER SHARE
|
890.7 | 888.0 |
STMicroelectronics N.V.
|
||||||||||||
CONSOLIDATED BALANCE SHEETS
|
||||||||||||
As at
|
March 29,
|
December 31,
|
March 30,
|
|||||||||
In millions of U.S. dollars
|
2014
|
2013
|
2013
|
|||||||||
(Unaudited)
|
(Audited)
|
(Unaudited)
|
||||||||||
ASSETS
|
||||||||||||
Current assets:
|
||||||||||||
Cash and cash equivalents
|
1,744 | 1,836 | 1,718 | |||||||||
Short-term deposits
|
1 | 1 | 1 | |||||||||
Marketable securities
|
- | 57 | 187 | |||||||||
Trade accounts receivable, net
|
1,112 | 1,049 | 1,025 | |||||||||
Inventories
|
1,331 | 1,336 | 1,306 | |||||||||
Deferred tax assets
|
130 | 123 | 141 | |||||||||
Assets held for sale
|
- | 16 | 37 | |||||||||
Other current assets
|
382 | 389 | 501 | |||||||||
Total current assets
|
4,700 | 4,807 | 4,916 | |||||||||
Goodwill
|
90 | 90 | 140 | |||||||||
Other intangible assets, net
|
228 | 217 | 208 | |||||||||
Property, plant and equipment, net
|
3,066 | 3,156 | 3,275 | |||||||||
Non-current deferred tax assets
|
222 | 227 | 439 | |||||||||
Restricted cash
|
- | - | 4 | |||||||||
Long-term investments
|
72 | 76 | 110 | |||||||||
Other non-current assets
|
639 | 600 | 540 | |||||||||
4,317 | 4,366 | 4,716 | ||||||||||
Total assets
|
9,017 | 9,173 | 9,632 | |||||||||
LIABILITIES AND EQUITY
|
||||||||||||
Current liabilities:
|
||||||||||||
Short-term debt
|
225 | 225 | 250 | |||||||||
Trade accounts payable
|
764 | 694 | 862 | |||||||||
Other payables and accrued liabilities
|
866 | 937 | 997 | |||||||||
Dividends payable to stockholders
|
4 | 89 | - | |||||||||
Deferred tax liabilities
|
- | - | 11 | |||||||||
Accrued income tax
|
51 | 48 | 77 | |||||||||
Total current liabilities
|
1,910 | 1,993 | 2,197 | |||||||||
Long-term debt
|
908 | 928 | 647 | |||||||||
Post-employment benefit obligations
|
366 | 366 | 474 | |||||||||
Long-term deferred tax liabilities
|
10 | 11 | 15 | |||||||||
Other long-term liabilities
|
148 | 158 | 351 | |||||||||
1,432 | 1,463 | 1,487 | ||||||||||
Total liabilities
|
3,342 | 3,456 | 3,684 | |||||||||
Commitment and contingencies
|
||||||||||||
Equity
|
||||||||||||
Parent company stockholders' equity
|
||||||||||||
Common stock (preferred stock: 540,000,000 shares authorized, not issued;
|
1,156 | 1,156 | 1,156 | |||||||||
common stock: Euro 1.04 nominal value, 1,200,000,000 shares authorized, 910,710,805 shares
|
||||||||||||
issued, 890,689,950 shares outstanding)
|
||||||||||||
Capital surplus
|
2,587 | 2,581 | 2,559 | |||||||||
Retained earnings
|
1,052 | 1,076 | 1,788 | |||||||||
Accumulated other comprehensive income
|
1,024 | 1,042 | 673 | |||||||||
Treasury stock
|
(212 | ) | (212 | ) | (239 | ) | ||||||
Total parent company stockholders' equity
|
5,607 | 5,643 | 5,937 | |||||||||
Noncontrolling interest
|
68 | 74 | 11 | |||||||||
Total equity
|
5,675 | 5,717 | 5,948 | |||||||||
Total liabilities and equity
|
9,017 | 9,173 | 9,632 |
STMicroelectronics N.V.
|
|||
SELECTED CASH FLOW DATA
|
|||
Cash Flow Data (in US$ millions)
|
Q1 2014
|
Q4 2013
|
Q1 2013
|
Net Cash from operating activities
|
53
|
270
|
66
|
Net Cash used in investing activities
|
(39)
|
(145)
|
(81)
|
Net Cash from (used in) financing activities
|
(105)
|
270
|
(481)
|
Net Cash increase (decrease)
|
(92)
|
402
|
(532)
|
Selected Cash Flow Data (in US$ millions)
|
Q1 2014
|
Q4 2013
|
Q1 2013
|
Depreciation & amortization
|
205
|
225
|
237
|
Net payment for Capital expenditures
|
(112)
|
(133)
|
(111)
|
Dividends paid to stockholders
|
(85)
|
(89)
|
(89)
|
Change in inventories, net
|
6
|
-
|
30
|
Q1 2014
(US$ millions and cents per share)
|
Gross Profit
|
Operating Income (loss)
|
Net Earnings
|
Corresponding EPS
|
U.S. GAAP
|
599
|
(4)
|
(24)
|
(0.03)
|
Impairment & Restructuring
|
12
|
12
|
||
Estimated Income Tax Effect
|
(1)
|
|||
Non-U.S GAAP
|
599
|
8
|
(13)
|
(0.01)
|
Q4 2013
(US$ millions and cents per share)
|
Gross Profit
|
Operating Income (loss)
|
Net Earnings
|
Corresponding EPS
|
U.S. GAAP
|
662
|
(11)
|
(36)
|
(0.04)
|
Impairment & Restructuring
|
29
|
29
|
||
Estimated Income Tax Effect
|
(6)
|
|||
Non-U.S GAAP
|
662
|
18
|
(13)
|
(0.01)
|
Q1 2013
(US$ millions and cents per share)
|
Gross Profit
|
Operating Income (loss)
|
Net Earnings
|
Corresponding EPS
|
U.S. GAAP
|
628
|
(281)
|
(171)
|
(0.19)
|
Impairment & Restructuring
|
101
|
58
|
||
Estimated Income Tax Effect
|
(3)
|
|||
Non-U.S GAAP
|
628
|
(180)
|
(116)
|
(0.13)
|
Net Financial Position (in US$ millions)
|
March 29, 2014
|
December 31, 2013
|
March 30, 2013
|
Cash and cash equivalents
|
1,744
|
1,836
|
1,718
|
Marketable securities
|
-
|
57
|
187
|
Short-term deposits
|
1
|
1
|
1
|
Non-current restricted cash
|
-
|
-
|
4
|
Total financial resources
|
1,745
|
1,894
|
1,910
|
Short-term debt
|
(225)
|
(225)
|
(250)
|
Long-term debt
|
(908)
|
(928)
|
(647)
|
Total financial debt
|
(1,133)
|
(1,153)
|
(897)
|
Net financial position
|
612
|
741
|
1,013
|
Free cash flow (in US$ millions)
|
Q1 2014
|
Q4 2013
|
Q1 2013
|
Net cash from operating activities
|
53
|
270
|
66
|
Net cash used in investing activities
|
(39)
|
(145)
|
(81)
|
Proceeds from sale of marketable securities and net cash variation for joint ventures deconsolidation
|
(65)
|
(34)
|
(50)
|
Free cash flow
|
(51)
|
91
|
(65)
|
STMicroelectronics N.V.
|
|||
Date: April 29, 2014 |
By:
|
/s/ Carlo Ferro
|
|
Name:
|
Carlo Ferro
|
||
Title:
|
Chief Financial Officer
Executive Vice President
Finance, Legal, Infrastructure and Services
|