New modular liquid cooling solutions designed to support next-generation AI chips

Collaborating with Siemens on joint reference architecture

nVent Project Deschutes CDU based on Google OCP specification

Highlighting new technology innovations in “We Do Cool Stuff” campaign

nVent Electric plc (NYSE: NVT) (“nVent”), a global leader in electrical connection and protection solutions, today announced its new, modular data center liquid cooling solutions aligned to chip manufacturers’ current and future cooling requirements. The new solutions include enhanced coolant distribution unit (CDU) offerings with new row and rack-based CDUs alongside advanced technology cooling system manifolds. They also include updated racks based on leading reference designs and a new services program. nVent will showcase these solutions alongside its next-generation intelligent power distribution units (PDUs) at SC25. At the show, nVent will also debut its new “We Do Cool Stuff” campaign and offer commentary on the evolution of liquid cooling alongside experts from NVIDIA, Lenovo, HPE and AMD.

“We are tapping into our deep technical expertise, and working collaboratively with chip manufacturers and the broader ecosystem, to solve our customers’ unique challenges with these new liquid cooling and power solutions,” said Eric Osborn, GM of nVent Data Solutions. “Our commitment to leading innovation for next-generation AI chips is at the core of the work we have done in the space for more than a decade.”

nVent will also showcase its new products in Tech Talks throughout the show and host Data Center Dynamics in its booth to produce educational content for the data center industry.

Leadership in Liquid Cooling and Power

nVent’s new cooling and power portfolio includes modular and scalable row-based CDUs, next generation PDUs, AC and DC rack CDUs, and new technology cooling system (TCS) manifolds. Together, these new solutions bring cutting edge cooling infrastructure to data centers to support the AI buildout. nVent’s new CDU and PDU products also include a common control platform that will enhance reliability and improve the user experience for data center operators.

The company will also highlight its data center services offering. Liquid cooling technology brings millions of dollars of IT equipment into close proximity with liquid, making correct installation and maintenance imperative to avoid costly downtime and repairs. nVent’s comprehensive suite of services, including installation, start-up, preventive maintenance, and spare parts and repairs, helps keep data center projects on time and running smoothly.

Collaborating with Industry Leaders

With its deep expertise, including years of experience with global installations and designing for serviceability, nVent is well positioned to deliver infrastructure solutions supporting next-generation reference architectures.

Modern data centers face increasing rack-level power densities, more compute-intensive workloads, and growing demand for modularity to maintain uptime and scalability. nVent and Siemens are combining their expertise to help data centers prepare cooling and power infrastructure for global deployment and operational resilience. The two companies are collaborating to develop a liquid cooling and power reference architecture, purpose-built for hyperscale AI workloads.

nVent is also excited to participate in Project Deschutes, and will exhibit its new CDU design based on Google’s specifications at SC25. Project Deschutes 5.0 is a CDU design specification for data centers made available through the Open Compute Project. Project Deschutes is designed to help accelerate the adoption of liquid cooling across the data center industry.

Highlighting Industry Experts

nVent experts will be on the ground and on social media at SC25 to share the latest industry insights from the rapidly growing data center space. Representatives from nVent, NVIDIA, Lenovo, HPE and AMD will appear together on a joint panel to discuss the legacy and next generation of liquid cooling in supercomputing. Leaning on decades of research, expertise and experience in the field, these leaders will provide insights into the future of cooling technology for data centers. This presentation will be held in booth 240-241-242 on Friday, November 21 at 8:30 a.m. CT.

Additionally, nVent will present “Tech Talks” every day in exhibit hall booth #2638. In these 15-minute presentations, nVent experts will highlight new products and answer critical industry questions to support data center managers working to deploy the latest AI technology.

We Do Cool Stuff

To showcase its leadership in the data center industry, legacy of innovation and how it is advancing the future of computing and IT infrastructure, nVent will debut a new marketing campaign: We Do Cool Stuff. Through campaign materials including video, social media, digital and print collateral, SC25 attendees will be invited to explore how nVent is building the future of data centers.

nVent is a leader and innovator in liquid cooling with a strong track record of solving complex cooling challenges for global cloud service providers. nVent’s industry-leading team of experts leverages its broad portfolio to help data center managers achieve their goals. Through collaboration with leading chip manufacturers, OEMs and hyperscalers, nVent delivers reliable, scalable liquid cooling solutions that are ready to meet the future of high-density computing.

Visit nVent at booth #3604, and learn more about nVent’s latest data center solutions: https://www.nvent.com/data-centers

About nVent

nVent is a leading global provider of electrical connection and protection solutions. We believe our inventive electrical solutions enable safer systems and ensure a more secure world. We design, manufacture, market, install and service high performance products and solutions that connect and protect some of the world's most sensitive equipment, buildings, and critical processes. We offer a comprehensive range of systems protection and electrical connections solutions across industry-leading brands that are recognized globally for quality, reliability, and innovation. Our principal office is in London and our management office in the United States is in Minneapolis. Our robust portfolio of leading electrical product brands dates back more than 100 years and includes nVent CADDY, ERICO, HOFFMAN, ILSCO, SCHROFF and TRACHTE. Learn more at www.nvent.com.

nVent, CADDY, ERICO, HOFFMAN, ILSCO, SCHROFF and TRACHTE are trademarks owned or licensed by nVent Services GmbH or its affiliates.

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“Our commitment to leading innovation for next-generation AI chips is at the core of the work we have done in the space for more than a decade.”--Eric Osborn, GM of nVent Data Solutions